TG-60 Liquid Metal Compound is Thermaltake’s first liquid metal compound with high thermal conductivity of
52 W/m-k, and can be applied on copper or nickel-plated materials with excellent cooling performance.

TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.

TG-50 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.